Integrated circuit packages, the form an IC is manufactured in, are as wide and varied as a Donald Trump “alternative truth”. Below is the big list of integrated circuit (IC) package types including the package name, package full (official) name, remarks and notes, and a picture of diagram of the electronic package.
Through-hole IC packages have leads which can be soldered onto a PCB or inserted into a breadboard slot.
SIP or SIL
Single in-line package
Has one row of connecting pins often with a lead frame used as a heat sink.
DIP (DIL or DIPP)
Dual in-line package
Has two parallel rows of connecting pins – 0.1 in (2.5 mm) pin spacing, rows 0.3 in (7.6 mm) or 0.6 in (15 mm) apart. Sometimes referred to as Dipn where n=total number of pins.
Glass sealed ceramic
QIP or QIL
Quadruple in-line package
Looks like a DIP but with staggered (zig-zag) pins to allow more reliable soldering.
Standard DIP with 0.1 inch pin spacing, rows 0.3 inches apart.
Zig-zag in-line package
A short-lived packaging technology initially intended to replace the dual in-line packaging. Typically has 20 or 40 pins with rows staggered 1.27mm apart. Used by Acorn and Commodore Amiga.
Surface mount packages
Ceramic Column Grid Array
Column Grid Array
A hermetically sealed ceramic package with leads extending from both of its longer sides.
Leadless leadframe package
Land Grid Array
Has pins on the socket (when a socket is used) rather than the IC. Contacts are connected to a grid of contacts on the PCB. Not all rows and columns of the grid are used. Used in microprocessors such as Intel Pentium 4, Xeon, Core 2, and AMD Opteron.
Low temperature co-fired ceramic
Entire Ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. Often used in military electronics or RF applications.
Come in a variety of forms and classified according to the technology used to create the HDI substrate.
Micro Surface Mount Device extended technology
A chip carrier has contacts on all four edges are are typically soldered onto a PCB circuit board or inserted into a socket.
Bump Chip Carrier
Ceramic Leadless Chip Carrier
Leadless Chip Carrier
Leaded Ceramic Chip Carrier
Leaded Ceramic Chip Carrier
Dual Leadless Chip Carrier (Ceramic)
Plastic Leaded Chip Carrier
Pin grid arrays
A pin grid array (PGA) is a package with pins arranged as an array on the underside of the package. Pins are commonly spaced 2.54mm apart and may or may not cover the entire underside of the package. PGAs are commonly mounted on printed circuit boards using the through-hole method or inserted into a socket.
Organic Pin Grid Array
FCPGA or FC-PGA
Flip-chip pin Grid Array
Pin Array Cartridge
PGA or PPGA
Pin grid array
Ceramic Pin Grid Array
Flat packages (aka Flatpack)
Flatpack is a US military standardized printed circuit board surface mount package.
Ceramic Flat Pack
Ceramic Quad Flat-Pack
Bumpered Quad Flat Pack
Type of QFP with bumpers on four corners to protect leads against mechanical damage
Dual Flat Pack
Exposed Thin Quad Flat Package
Power Quad Flat-Pack
Plastic Quad Flat Package
Low-profile Quad Flat Package
Quad Flat No-leads package
Also called MLF. Offers advantages including reduce lead inductance, small footprint, and low weight.
Quad Flat Package
A surface mount IC package with gull wing leads extending from each of its four sides. Similar to a PLCC package but with pins of less pitch. Typically 2.0 to 3.8 mm thick.
Metric Quad Flat Pack
QFP with metric pin distribution
Heat-sink Very-thin Quad Flat-pack No-leads
A type of QFP with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed DIE that can be used as ground.
Ceramic package with leads extending from both of the longer sides (a type of dual in-line package). It is hermetically sealed with a metal cap.
Thin Quad Flat Pack
Similar to QFP but thinner. Typically has pins with 0.8mm pitch in a package 5mm by 5mm by 1mm thick.
Thin Quad Flat No-Lead
Very-thin Quad Flat Pack
Optical Dual Flat No-Lead
Packaged in a transparent package for use in optical sensors
Small outline packages
Small Outline Package
Ceramic Small Outline Package
Thermally Enhanced Small-Outline Package
Mini Small-Outline Package
Plastic Small-Outline Package
Plastic Small-Outline No-Lead Package
Quarter-Size Small-Outline Package
Small Outline Integrated Circuit
Also known as SOIC NARROW and SOIC WIDE. Typically named SOIC-n where n= number of pins.
J-leaded SOIC package
A version of SOIC with J-type leads instead of gull-wing leads.
Shrink Small-Outline Package
Have gull wing leads protruding from two long sides with lead spacing of 0.65mm. Often used in pagers, portable audio/video, disc drives, radio, and telecom products.
Thin Small-Outline Package
Thin Shrink Small Outline Package
Has legs protruding from the wide portion of the package with a leg count of 8 to 64.
Thin Very Small-Outline Package
Maxim trademarked package similar to a SOIC
Very Very Thin Small Outline No Lead Package
ICs with an area no greater than 1.2 times that of the die (per J-STD-012 standard).
Chip Scale Package
Package is no more than 1.2x the size of the silicon chip
TCSP or TDSP
True Chip Size Package
Package is same size as silicon
CSP developed by National Semiconductor
A bare silicon chip without a package
Variation of COB – chip mounted on flex circuit
Variation of COB – chip mounted on piece of glass (i.e. LCD)
Ball grid array
Surface-mount package typically used to permanently mount devices such as microprocessors. Soldering of these devices must be precise and is typically done by automated processes.
Fine Pitch Ball Grid Array
Low Profile Ball Grid Array
Also known as Laminate Ball Grid Array
Thermally Enhanced Plastic Ball Grid Array
Ceramic Ball Grid Array
Organic Ball Grid Array
Thin Fine Pitch Ball Grid Array
Chip-Array Thin Core Ball Grid Array
Plastic Ball Grid Array
Mold Array Process – Ball Grid Array
Micro Chip Scale Package
Micro-Ball Grid Array
Ball spacing is less than 1mm
Low Profile Fine Pitch Ball Grid Array
Thin Ball Grid Array
Very Thin Ball Grid Array
Super Ball Grid Array
Has more than 500 pins
Ultra Fine Ball Grid Array
Transistor, diode, and small pin packages
Metal Electrode Leadless Face
Type of leadless surface mount package that is metalized on both ends.
Small Outline Diode
Surface mount diode package.
Small footprint, surface mount typically used for transistors but also diodes and voltage regulators.
Panel mount with leads
Often used for transistors, rectifiers, and ICs. Usually has two mounting holes, two leads, the case being the third connection.
Metal can package with radial leads
Often used for transistors and some integrated circuits. Base diameter of 8.9mm, cap diameter of 8.1mm, and cap height of 6.3mm.
Metal can package with radial leads
Metal cased, simliar to TO-92 package (but more expensive). The tab is located 45 degree from pin 1 (typically the emitter). Lead diameter of .45 mm, cap diameter of 4.5 – 4.95mm, and overall width of 5.4mm.
Similar to TO-3 but smaller.
Similar to the TO-3 package but smaller.
Plastic encapsulated package with three leads
Widely used for transistors. Typically cased with epoxy or plastic.
Plastic encapsulated package with three leads and a hole for mounting on a heat sink
Through-hole plastic package typically with a metal heat sink tab and three leads
A small plastic-molded transistor outline package commonly used for discrete devices such as transistors, thyristors, and ICs with low lead counts.
Plastic encapsulated package with three leads and hole for mounting on a heat sink
TO-251 or IPAK
Similar to DPAK but with longer leads
TO-252 (SOT428 or DPAK)
Similar to DPAK but smaller
Similar to D2PAK but with longer leads
Similar to TO-220 without the extended tab and mounting hole
Similar to TO-247 but without the mounting hole
IC chip dimensions
C – Clearance between IC body and PCB H – Total Height T – Lead Thickness L – Total Carrier Length LW – Lead Width LL – Lead Length P – Pitch
C – Clearance between IC body and board H Total Height T – Lead Thickness L – Total Carrier Length LW – Lead Width LL – Lead Length P – Pitch WB – IC Body Width WL – Lead-to-Lead Width-
All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).
C – Clearance between package body and PCB. H – Height of package from pin tip to top of package. T – Thickness of pin. L – Length of package body only. LW – Pin width. LL – Pin length from package to pin tip. P – Pin pitch (distance between conductors to the PCB). WB – Width of the package body only. WL – Length from pin tip to pin tip on the opposite side.
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