Integrated circuit packages, the form an IC is manufactured in, are as wide and varied as a Donald Trump “alternative truth”.  Below is the big list of integrated circuit (IC) package types including the package name, package full (official) name, remarks and notes, and a picture of diagram of the electronic package.

Through-hole packages

Through-hole IC packages have leads which can be soldered onto a PCB or inserted into a breadboard slot.

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SIP or SIL	Single in-line package	Has one row of connecting pins often with a lead frame used as a heat sink.
DIP (DIL or DIPP)	Dual in-line package	Has two parallel rows of connecting pins – 0.1 in (2.5 mm) pin spacing, rows 0.3 in (7.6 mm) or 0.6 in (15 mm) apart. Sometimes referred to as Dipn where n=total number of pins.
CDIP	Ceramic DIP
CERDIP	Glass sealed ceramic
QIP or QIL	Quadruple in-line package	Looks like a DIP but with staggered (zig-zag) pins to allow more reliable soldering.
SDIP	Skinny DIP	Standard DIP with 0.1 inch pin spacing, rows 0.3 inches apart.
ZIP	Zig-zag in-line package	A short-lived packaging technology initially intended to replace the dual in-line packaging. Typically has 20 or 40 pins with rows staggered 1.27mm apart. Used by Acorn and Commodore Amiga.
MDIP	Molded DIP
PDIP	Plastic DIP

 

Surface mount packages

CCGA	Ceramic Column Grid Array
CGA	Column Grid Array
CERPACK	Ceramic package	A hermetically sealed ceramic package with leads extending from both of its longer sides.
CQGP
LLP	Leadless leadframe package
LGA	Land Grid Array	Has pins on the socket (when a socket is used) rather than the IC. Contacts are connected to a grid of contacts on the PCB.  Not all rows and columns of the grid are used. Used in microprocessors such as Intel Pentium 4, Xeon, Core 2, and AMD Opteron.
LTCC	Low temperature co-fired ceramic	Entire Ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. Often used in military electronics or RF applications.
MCM	Multi-Chip Module	Come in a variety of forms and classified according to the technology used to create the HDI substrate.
MICRO SMDXT	Micro Surface Mount Device extended technology

Chip carrier

A chip carrier has contacts on all four edges are are typically soldered onto a PCB circuit board or inserted into a socket.

BCC	Bump Chip Carrier
CLCC	Ceramic Leadless Chip Carrier
LCC	Leadless Chip Carrier
LCC	Leaded Ceramic Chip Carrier
LCCC	Leaded Ceramic Chip Carrier
DLCC	Dual Leadless Chip Carrier (Ceramic)
PLCC	Plastic Leaded Chip Carrier

Pin grid arrays

A pin grid array (PGA) is a package with pins arranged as an array on the underside of the package.  Pins are commonly spaced 2.54mm apart and may or may not cover the entire underside of the package.  PGAs are commonly mounted on printed circuit boards using the through-hole method or inserted into a socket.

OPGA	Organic Pin Grid Array
FCPGA or FC-PGA	Flip-chip pin Grid Array
PAC	Pin Array Cartridge
PGA or PPGA	Pin grid array
CPGA	Ceramic Pin Grid Array

Flat packages (aka Flatpack)

Flatpack is a US military standardized printed circuit board surface mount package.

CFP	Ceramic Flat Pack
CQFP	Ceramic Quad Flat-Pack
BQFP	Bumpered Quad Flat Pack	Type of QFP with bumpers on four corners to protect leads against mechanical damage
DFN	Dual Flat Pack
ETQFP	Exposed Thin Quad Flat Package
PQFN	Power Quad Flat-Pack
PQFP	Plastic Quad Flat Package
LQFP	Low-profile Quad Flat Package
QFN	Quad Flat No-leads package	Also called MLF. Offers advantages including reduce lead inductance, small footprint, and low weight.
QFP	Quad Flat Package	A surface mount IC package with gull wing leads extending from each of its four sides. Similar to a PLCC package but with pins of less pitch. Typically 2.0 to 3.8 mm thick.
MQFP	Metric Quad Flat Pack	QFP with metric pin distribution
HVQFN	Heat-sink Very-thin Quad Flat-pack No-leads	A type of QFP with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed DIE that can be used as ground.
SIDEBRAZE	Sidebraze package	Ceramic package with leads extending from both of the longer sides (a type of dual in-line package). It is hermetically sealed with a metal cap.
TQFP	Thin Quad Flat Pack	Similar to QFP but thinner. Typically has pins with 0.8mm pitch in a package 5mm by 5mm by 1mm thick.
TQFN	Thin Quad Flat No-Lead
VQFP	Very-thin Quad Flat Pack
ODFN	Optical Dual Flat No-Lead	Packaged in a transparent package for use in optical sensors

Small outline packages

SOP	Small Outline Package
CSOP	Ceramic Small Outline Package
HSOP	Thermally Enhanced Small-Outline Package
MSOP	Mini Small-Outline Package
PSOP	Plastic Small-Outline Package
PSON	Plastic Small-Outline No-Lead Package
QSOP	Quarter-Size Small-Outline Package
SOIC	Small Outline Integrated Circuit	Also known as SOIC NARROW and SOIC WIDE.  Typically named SOIC-n where n= number of pins.
SOJ	J-leaded SOIC package	A version of SOIC with J-type leads instead of gull-wing leads.
SSOP	Shrink Small-Outline Package	Have gull wing leads protruding from two long sides with lead spacing of 0.65mm. Often used in pagers, portable audio/video, disc drives, radio, and telecom products.
TSOP	Thin Small-Outline Package
TSSOP	Thin Shrink Small Outline Package	Has legs protruding from the wide portion of the package with a leg count of 8 to 64.
TVSOP	Thin Very Small-Outline Package
uMAX		Maxim trademarked package similar to a SOIC
WSON	Very Very Thin Small Outline No Lead Package

Chip-Scale packages

ICs with an area no greater than 1.2 times that of the die (per J-STD-012 standard).

CSP	Chip Scale Package	Package is no more than 1.2x the size of the silicon chip
TCSP or TDSP	True Chip Size Package	Package is same size as silicon
MICRO SMD		CSP developed by National Semiconductor
COB	Chip-on-board	A bare silicon chip without a package
COF	Chip-on-flex	Variation of COB – chip mounted on flex circuit
COG	Chip-on-glass	Variation of COB – chip mounted on piece of glass (i.e. LCD)

Ball grid array

Surface-mount package typically used to permanently mount devices such as microprocessors. Soldering of these devices must be precise and is typically done by automated processes.

FBGA	Fine Pitch Ball Grid Array
LBGA	Low Profile Ball Grid Array	Also known as Laminate Ball Grid Array
TEPBGA	Thermally Enhanced Plastic Ball Grid Array
CBGA	Ceramic Ball Grid Array
OBGA	Organic Ball Grid Array
TFBGA	Thin Fine Pitch Ball Grid Array
CTBGA	Chip-Array Thin Core Ball Grid Array
PBGA	Plastic Ball Grid Array
MAP-BGA	Mold Array Process – Ball Grid Array
UCSP	Micro Chip Scale Package
uBGA	Micro-Ball Grid Array	Ball spacing is less than 1mm
LFBGA	Low Profile Fine Pitch Ball Grid Array
TBGA	Thin Ball Grid Array
VTBGA	Very Thin Ball Grid Array
SBGA	Super Ball Grid Array	Has more than 500 pins
UFBGA	Ultra Fine Ball Grid Array

Transistor, diode, and small pin packages

MELF	Metal Electrode Leadless Face	Type of leadless surface mount package that is metalized on both ends.
SOD	Small Outline Diode	Surface mount diode package.
SOT	Small-outline transistor	Small footprint, surface mount typically used for transistors but also diodes and voltage regulators.
TO-3	Panel mount with leads	Often used for transistors, rectifiers, and ICs.  Usually has two mounting holes, two leads, the case being the third connection.
TO-5	Metal can package with radial leads	Often used for transistors and some integrated circuits. Base diameter of 8.9mm, cap diameter of 8.1mm, and cap height of 6.3mm.
TO-18	Metal can package with radial leads	Metal cased, simliar to TO-92 package (but more expensive).  The tab is located 45 degree from pin 1 (typically the emitter). Lead diameter of .45 mm, cap diameter of 4.5 – 4.95mm, and overall width of 5.4mm.
TO-39
TO-46
TO-66	Similar to TO-3 but smaller.	Similar to the TO-3 package but smaller.
TO-92	Plastic encapsulated package with three leads	Widely used for transistors. Typically cased with epoxy or plastic.
TO-99
TO-100
TO-126		Plastic encapsulated package with three leads and a hole for mounting on a heat sink
TO-220		Through-hole plastic package typically with a metal heat sink tab and three leads
TO-226		A small plastic-molded transistor outline package commonly used for discrete devices such as transistors, thyristors, and ICs with low lead counts.
TO-247		Plastic encapsulated package with three leads and hole for mounting on a heat sink
TO-251 or IPAK		Similar to DPAK but with longer leads
TO-252 (SOT428 or DPAK)		Similar to DPAK but smaller
TO-262 (I2PAK)		Similar to D2PAK but with longer leads
TO-263 (D2PAK)		Similar to TO-220 without the extended tab and mounting hole
TO-274 (Super-247)		Similar to TO-247 but without the mounting hole

Additional information

IC chip dimensions

Surface-mount

C – Clearance between IC body and PCB
H – Total Height
T – Lead Thickness
L – Total Carrier Length
LW – Lead Width
LL – Lead Length
P – Pitch

Through hole

C – Clearance between IC body and board
H Total Height
T – Lead Thickness
L – Total Carrier Length
LW – Lead Width
LL – Lead Length
P – Pitch
WB – IC Body Width
WL – Lead-to-Lead Width-

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

C – Clearance between package body and PCB.
H – Height of package from pin tip to top of package.
T – Thickness of pin.
L – Length of package body only.
LW – Pin width.
LL – Pin length from package to pin tip.
P – Pin pitch (distance between conductors to the PCB).
WB – Width of the package body only.
WL – Length from pin tip to pin tip on the opposite side.